Thin film metrology

Desirable thickness and composition monitoring metrology capabilities. X-ray metrology is the ideal tool for thin film analysis of compound semiconductors in the development and mass production of epitaxial, layer- structured micro- and optoelectronic devices. Measurement tools based on X-ray methods, such as XR XRR and XRF, have proven to be powerful for ex-situ . Our integrated systems are based on our miniature spectroscopy technology.

The systems provide solutions for thin film thickness measurements, plasma analysis and optical characterization.

They are fully integrated with software and applications database support.

In combination with this tren a significant portion of current research and development concerns the use of polymeric flexible materials having complex optical properties.

A thin - film - metrology technique, spectroscopic ellipsometry ( SE), appears to be one of the most accurate and reliable techniques for . The NanoSpec II is fully compatible to material cards . The Aleris Family of film metrology tools provides reliable and precise measurement of film thickness, refractive index, stress and composition for the 32nm node and beyond. The techniques available for this measurement range from profilometry to ellipsometry, spectroscopic reflectometry and x-ray . Thin film metrology and wafer inspection for defects are integral to controlling the semiconductor manufacturing process. Film properties, linewidths, and defect levels need to be measure first to optimize the manufacturing process . Nanometrics pioneered the use of micro- spot spectroscopic reflectometry for semiconductor film metrology. Spectroscopic reflectometry uses multiple wavelengths (colors) of light to obtain an array of data for analysis of film thickness and other film parameters.

Accessories for any thin film characterization needs. Manufactures exceptionally high resolution, state-of-the-art scatterometry (OCD) and thin film metrology tools for the semiconductor, photomask, data storage. Title: Wearable and flexible technologies enabled by advanced thin - film manufacture and metrology. Principal Investigator: Bhaskaran, Professor H. Optical metrology techniques (such as Spectral Ellipsometry – currently the throughput-intensive workhorse of thin film measurements) are . Our thin film metrology instruments use spectroscopic ellipsometry, laser ellipsometry and reflectometry to measure thin film properties such as thickness, refractive index, and other useful properties. March Signaling another milestone in its . Critical films , such as ultra- thin diffusion layers, typically have the smallest dimensions and narrowest process tolerances.

Non-critical films , which comprise the majority of . Tackle the most challenging thin film applications with the next generation ellipsometer: UVISEL 2! Multi-Angle spectroscopic ellipsometry and reflectometry. Our tools are used for monitoring nearly all thin - film deposition processes, including MBE, MOCV PL PV sputtering, and evaporation. Metrology for the manufacturing of thin films. Our products utilize optical imaging technology for .